Mobile chips: focusing on 4G turnkey solutions into industry templates

From the series of chip manufacturers' announcements on MWC, the technology around the network and user experience has become the focus. However, in response to the "nuclear" war left over from last year, it has also entered a new state: on the one hand, Qualcomm is emphasizing that nuclear is not the key; on the other hand, Intel "strikes up" this year.

Qualcomm: Full force on 4G LTE

Judging from the content released by Qualcomm this time, 4G LTE has become one of the key areas of concern.

As the industry's first 4GLTEAdvanced embedded data connection platform, it marks the advent of Qualcomm's third-generation 4GLTE embedded chip. It will be used in mobile computing terminals such as ultra-thin notebook computers, tablet computers, and composite design computers. The platform uses an embedded mobile computing solution based on Qualcomm's GobiMDM9225 and MDM9625 chipsets, and supports LTE carrier aggregation and LTE Category 4, with a peak data transmission rate of up to 150 Mbit / s.

In addition, Qualcomm recently released the RF360 front-end solution to help OEMs develop thinner, more power-efficient mobile terminal products that support global 4G LTE networks. This system-level solution enables the design of a single mobile terminal supporting all 4G LTE standards and frequency bands in the world, and has been integrated into a comprehensive system-level LTE solution provided to OEM manufacturers.

Intel: The quad-core timetable is out

Intel not only launched dual-core products on mobile phones, it will also be used to support Android tablets. It is understood that this research and development code-named "CloverTrail +" based on its dual-core smart processor platform was released at this MWC.

The product's 32-nanometer process technology provides double computing performance and triple graphics capabilities as well as competitive battery life, and is mainly targeted at high-performance and mainstream smartphone market segments. The vendors that announced support for this platform include Asustek, Lenovo and ZTE. It is reported that at the end of 2013, Intel will further transition to the 22-nanometer Atom system chip.

In addition, Intel also revealed that the next-generation Atom system chip code-named "BayTrail" is also supported by the first quad-core Atom system chip, which is scheduled to be launched during the Christmas period at the end of 2013.

For 4GLTE, Intel has released the multi-mode-multi-baseband LTE solution XMM7160, which supports multiple devices such as smartphones, tablets, and ultrabooks. The solution can achieve global roaming with advanced envelope tracking and antenna deployment technology in one SKU. Single-mode products will be shipped from today, and multi-mode products will also be shipped in the first half of 2013.

MediaTek: Launch of Full HD Image Display Technology

On February 25, MediaTek launched the image display technology "MiraVision", which is mainly used in smartphones and tablet platforms. The software and hardware combination kit of this technology can enable users to obtain the same high-quality visual experience under different resolution conditions. At the same time, based on MediaTek ’s high-quality image display technology for digital TVs, MiraVision can provide mobile terminals with seamless full-HD picture quality, thereby prompting mobile terminal manufacturers to simplify the product development process, greatly shorten the time to market and create an optimal picture. Quality mobile platform to meet the differentiated needs of users.

In addition, at the MWC, MediaTek also announced that the three Android tablet PCs, including the Lenovo Tablet PC IdeaTabS6000, are equipped with its quad-core system-on-a-chip.

STMicroelectronics: Increase the number of LTE frequency bands supported by terminals

STMicroelectronics released and demonstrated its ThorM7450 which is currently providing samples to customers. The LTEAdvancedmodem platform can support carrier aggregation through a single radio frequency solution. Through this modem product, ST-Ericsson can significantly increase the number of LTE frequency bands supported by mobile terminals, so that terminal equipment manufacturers can develop an LTE product to meet the needs of the global LTE market, avoiding the development of too many similar products Trouble.

Broadcom: positioning chip supports "geographic fence"

This time Broadcom demonstrated the global navigation satellite system (GNSS) chip BCM47521. The chip achieves the "geo-fence" function through a unique architecture, while extending the battery life. This chip opens the door to new types of positioning services, such as social networks, mobile business services for specific locations, and advertising and marketing for local businesses. It is understood that the BCM47521 can continuously monitor geofencing information while reducing power consumption to one-sixtieth. In addition, it also provides multi-satellite system support functions, enabling faster search and more accurate navigation.

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