SEMI releases 8 new technology standards

2019-05-07 04:04:34

SEMI has released eight new technology standards for the semiconductor, MEMS, FPD and photovoltaic manufacturing industries. These new standards were developed by equipment materials suppliers and device manufacturers' technical experts who participated in the SEMI International Standards Project.

These new standards are:

SEMI T20.3, Service Communication Specification for Semiconductor and Related Product Identification

SEMI E158, Mechanical Specifications for Wafer Transfer Equipment for Transfer and Storage of 450mm Wafers

SEMI M76, 450mm polished monocrystalline silicon wafer development specification

SEMI D60, FPD Polarized Film and Test Method for Scratch Resistance Characteristics of Materials

Mechanical specification for SEMI E156, 450mm wafer storage transfer interface

SEMI E157, Specification for Module Process Tracking

SEMI D59, 3D display terminology

SEMI PV4, Specification for the Fifth Generation Substrate Size Range for Thin Film Photovoltaics

Edit: Pony

High Precision Multilayer PCB|multilayer printed circuit board

Product name:
Industrial control board

Characteristic:
1, the board design integration is very high;
2, the need to use composite surface treatment method, gold finger plating hard gold 30 uinch;
3, gold finger position plate thickness tolerance 1.6mm+/-0.10mm, it is recommended that customers in the design of the gold finger corresponding to the inner line of the copper block, in order to facilitate the plate thickness tolerance control.

High precision multi layer board multilayer printed circuit board

Specifications:
Layer count: 6
Board thickness: 1.60mm
Base materials: FR4 S1141
Finished size: 172*148mm
Surface finish: Gold Plated + finger
Line width/line space: 5/5mil
Minimum hole: 0.25mm
Solder resist color: blue
Cu thickness: inner layer 1 OZ outer layer 1 OZ

Product name:
Thick Copper Board

Characteristic:
Prominent features: the outer layer of copper thickness of 6 OZ, the inner product of copper thickness 6 OZ, commonly used in large power equipment.
Processing difficulties:
1, inside and outside the need to increase the thickness of copper thickness of 2 OZ or more by electroplating method;
2, before pressing the need to fill in the inner layer of resin;
3, the inner and outer layer circuit is difficult to etch;
4, solder resist the need for multiple printing.

High precision multi layer board multilayer printed circuit board Specifications:
Layer count: 4
Board thickness: 3.0mm
Base materials: FR4 S1000-2
Finished size: 175*104mm
Surface finish:
Line width/line space: 12/12mil
Minimum hole: 0.5mm
Solder resist color: Sensitive green
Cu thickness: inner layer 6 OZ outer layer 6 OZ

Product name:
Data acquisition board

Characteristic:
1, the integration of the board design is very high, thick diameter ratio of more than 10:1, heavy copper plating is difficult;
2, the use of TG 170 plate production.

High precision multi layer board multilayer printed circuit board

Specifications:
1, the integration of the board design is very high, thick diameter ratio of more than 10:1, heavy copper plating is difficult;
2, the use of TG 170 plate production.
Layer count: 8
Board thickness: 4.0mm
Base materials: FR4 S1000-2
Finished size: 400*400mm
Surface finish: mmersion
Line width/line space: 5/5mil
Minimum hole: 0.35mm
Solder resist color: Sensitive green
Cu thickness: inner layer 1 OZ outer layer 1 OZ

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BentePCB is a professional PCB manufacturing which is focus on double side, multilayer, HDI PCB , rigid PCB and Flexible PCB mass production. The company was established on 2011.
We have two factories together, The factory in Shenzhen is specialized in small and middle volume orders and the factory in Jiangxi is for big volumn.

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UL (E492586), ISO9001, ISO14001, TS16949, RoHS certified.
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15,000 sqm area, 450 staff .
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