LG Innotek develops "high quality flip chip LED package" that can withstand soldering processes at temperatures up to 300 degrees Celsius
Achieve 220 lm/W light stability at 300 °C
LG Innotek said today that it has successfully developed a high-efficiency, high-gloss "high-performance flip-chip LED package" that can withstand soldering processes at temperatures up to 300 degrees Celsius without affecting its performance, and will begin mass production in January. This is an innovative product that overcomes the quality limits of existing flip-chip LED packages and expands their range of applications.
LG Innotek uses state-of-the-art semiconductor technology to develop a high-quality flip-chip LED package that dramatically increases product reliability. In this way, the productization of high-efficiency and high-speed high-speed illumination at medium power and high power is realized.
Flip-chip LEDs directly attach the electrodes of the chip to the PCB board, eliminating the need for electrode connections, so they do not break and have excellent heat protection. Flip-chip LEDs, as high-power LED light sources, have been receiving attention from the BLU (Back Light Unit) industry since about three years ago.
However, the existing LED package circulating on the market is a form of CSP (Chip Scale Package) which omits the emission white resin and has a simple process, and is generally used only for high-power LED light sources and is exposed. At high temperatures, the connection between the chip and the board will melt, resulting in a problem of chip position shift and brightness reduction of nearly 10%.
When manufacturing lighting modules and finished products, it is difficult to guarantee the quality of lighting with the existing flip chip LED package and reflective white resin when the process temperature is as high as 250 degrees or more.
The "high-quality flip-chip LED package" developed by LG Innotek will not melt the connection between the chip and the board even at a high temperature of 250 to 300 degrees, and it can stably achieve high luminous efficiency of 220 lm/W. The company explained that lighting companies can use the flip-chip LED package to make high-quality lighting for bulbs, pipes, and flat panels without worrying about the quality of the light.
LG Innotek has independently designed the internal structure and process of the package, and has improved the existing flip chip assembly technology and developed a flip chip LED package. The internal structure of the chip has also been redesigned using original technology to maximize thermal protection.
At the same time, LG Innotek focused on high quality, and only reliability testing took more than 6,000 hours. Such "high-quality flip-chip LED packages" achieve stable performance even when subjected to high-temperature thermal shocks required by customers. Due to the high-intensity quality verification, the product development time is longer than the general popularity of 2 years.
And LG Innotek applied for 65 new technology patents during the development process. While preempting the core technology, LG Innotek has made a very thorough preparation in order to allow customers to focus on the production and sales of modules and finished products without worrying about patent disputes.
LG Innotek has built a "high quality flip chip LED package" product line to be tailored to the application of the lighting. Its core product group consists of a medium-power high-efficiency model of various color temperatures such as 220lm/W level 5630 3V products and 215lm/W level 3030 3V products.
In particular, LG Innotek uses the original technology to realize the 6V, 9V, 12V direct-connected single-chip flip-chip LED package that is difficult to manufacture due to design limitations in the 3030 product group, further strengthening the high-power and high-speed production line.
In the future, LG Innotek plans to continue to introduce innovative light source products such as vehicles, UVs, and micro LEDs through such core technologies to provide differentiated value to customers and lead the market.
LG Innotek said, "'High-quality flip-chip LED package' is a high-quality innovation that raises the reliability of lighting by one stage." "It is expected to replace the existing LED package and expand the scope of application."
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