Hongli Optoelectronics: COB package automatic production mode leader
[Several] If SMD was the mainstream two years ago, then in 2014, COB packaging is entering the mainstream of the market, and the total production increased by 20%-30% compared with 2013. Among them, COB packaged bulbs even account for 40%-50% of the market. According to relevant data, the total share of COB in China's packaged products has exceeded 7%, and it is widely used in high-power LEDs for street lamps, direct-lit backlights, spotlights and other high-brightness applications. The demand will be 185 from 2014. The number of billions will increase to 27 billion in 2017, and the compound annual growth rate will reach 13%.
The COB package, the Chip On Board, adheres the bare chip to the interconnect substrate with conductive or non-conductive glue, and then performs wire bonding to achieve electrical connection. If the bare chip is directly exposed to the air, it is susceptible to contamination or man-made damage, affecting or destroying the function of the chip, so the chip and the bonding wire are encapsulated by glue. This package is also referred to as a soft encapsulation.
As early as 2008, when COB packaging was in the ascendant, Hongli Optoelectronics made the first generation COB package with fixed fiber layer. At that time, Hongli Optoelectronics was the first to realize that this concentrating and space-saving design would be promising in the field of lighting. It proved that Hongli Optoelectronics had a keen judgment.
The road of Hongli Optoelectronics' fully automated production line is not smooth. The COB production process is complicated, and the layout of the core wire and the dispensing must be completed in a good programming. Improve the connection of the equipment, make a unique design in the program, develop and transform the equipment, and complete the dispensing in one time. Hongli Optoelectronics has made numerous attempts in the connection and design of each link and link, and finally has set up its own fully automated COB packaging production line.
The market is the most direct way to verify technology. At present, Hongli Optoelectronics' COB products have won a certain market share in four important LED application fields. The COB LT series for outdoor lighting, the COB LM series for indoor lighting, the COB RGB series for stage lighting in segmentation and the COB LC series for automotive lighting. In addition to the expansion of equipment and capacity, Hongli Optoelectronics will pay more attention to product performance and stability (third-party LM-80 test). From the perspectives of technology, capacity and market, it will provide customers with the best cost and higher energy efficiency. COB packaged devices.
The COB package, the Chip On Board, adheres the bare chip to the interconnect substrate with conductive or non-conductive glue, and then performs wire bonding to achieve electrical connection. If the bare chip is directly exposed to the air, it is susceptible to contamination or man-made damage, affecting or destroying the function of the chip, so the chip and the bonding wire are encapsulated by glue. This package is also referred to as a soft encapsulation.
As early as 2008, when COB packaging was in the ascendant, Hongli Optoelectronics made the first generation COB package with fixed fiber layer. At that time, Hongli Optoelectronics was the first to realize that this concentrating and space-saving design would be promising in the field of lighting. It proved that Hongli Optoelectronics had a keen judgment.
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The road of Hongli Optoelectronics' fully automated production line is not smooth. The COB production process is complicated, and the layout of the core wire and the dispensing must be completed in a good programming. Improve the connection of the equipment, make a unique design in the program, develop and transform the equipment, and complete the dispensing in one time. Hongli Optoelectronics has made numerous attempts in the connection and design of each link and link, and finally has set up its own fully automated COB packaging production line.
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The market is the most direct way to verify technology. At present, Hongli Optoelectronics' COB products have won a certain market share in four important LED application fields. The COB LT series for outdoor lighting, the COB LM series for indoor lighting, the COB RGB series for stage lighting in segmentation and the COB LC series for automotive lighting. In addition to the expansion of equipment and capacity, Hongli Optoelectronics will pay more attention to product performance and stability (third-party LM-80 test). From the perspectives of technology, capacity and market, it will provide customers with the best cost and higher energy efficiency. COB packaged devices.
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