CSP's three mainstream structures and the replacement of existing LEDs

The full name of CSP is ChipScalePackage, which means chip-level packaged device, which refers to a packaged device with a package size smaller than 1.2 times the size of the chip. Samsung's largest LM-131A has a chip size of 0.78*0.78mm and a package size of 1.42. *1.42. Strictly speaking, the package size of current mainstream chip manufacturers does not meet this requirement, so it is a bit rigorous to call it CSP. The name of the unpackaged chip is introduced from Taiwan, because the chip does not go through the traditional solid crystal and wire bonding process, so it is commonly called unpackaged chip.

CSP unpackaged chip three mainstream structures

The first camp: pressed with silica gel, five sides of light, high light efficiency, but the top and surrounding color temperature consistency control is poor. At present , Dehao Runda 's CSP is based on this.

The second camp: using the surrounding titanium dioxide to protect the fluorescent film, only the top one of the light-emitting surface, the light consistency and directivity is very good, but the loss of light output around, the light effect will be low. At present, Samsung mainly uses this technology, but it is also developing the first technology of Dehao Runda. Dehao Runda is also developing Samsung's technology products.

The third camp: full coverage of fluorescent film, plus transparent silica gel fixed molding, is also five-sided light, high light efficiency, light quality is slightly poor, this model is mainly used by Philips.

It is worth mentioning here that there is also a self-proclaimed CSP on the market with a substrate, although it can also be small, but not the final form.

Replace traditional LED three application areas

The earliest use of CSP is in backlights and flashlights. At present, Apple and Samsung's mobile phone flashes use CSP unpackaged chips, and CSP unpackaged chips used in Samsung and LG's ultra-thin TV parts. In the lighting industry, CSP is more and more widely used because of its small size and flexibility. Currently mainly in three areas:

First, it can directly replace medium power and high power.

The second type is a multi-matrix arrangement, which replaces the COB. Because of the problem of the spacing of the beads, it is temporarily unable to meet the small-angle spotlights with particularly high spot requirements. However, according to Fu Haiyong, head of R&D, this CSP technology still has the opportunity to replace COB. The reason for imaging is well solved.

Matrix arrangement

The third is the CSP plus lens, which replaces the low power inside the panel light.

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