Machine vision LED chip detection method

At present, LED chip automated production equipment mainly relies on imports and is expensive, which is not conducive to the development of the industry. The production of some small and medium-sized enterprises is still in a manual or semi-manual state, and the efficiency is low. Domestically, LED chip automation production equipment is still in the development stage, and there is no product with completely independent intellectual property rights. Therefore, it is imperative to speed up the research of its key algorithms.

In the LED production process, the detection and positioning of LED chips is one of the key technologies. Automatic positioning of the LED chip by the computer can effectively reduce the labor intensity of the worker and greatly improve the work efficiency, thereby saving a lot of human and material costs. Under the existing conditions, the LED chip image is automatically captured by the camera installed on the production line, and the image is analyzed by computer vision technology, and the LED chip positioning information (including the tilt angle and position of the chip) can be accurately obtained. The information can control the automatic soldering of the LED chip.

Machine chip based LED chip positioning algorithm. Firstly, the acquired image is preprocessed to reduce noise and locate the chip area and the soldering area; then the tilt of the chip is located based on the minimum outer rectangle; finally, the line boundary line and the soldering piece are located by the line detection algorithm. The area boundary is straight and the two lines are used to position the chip on the conveyor. The experimental results show that the positioning algorithm can obtain these parameters for the welding control of LED chip production.

Pretreatment

Since random noise is inevitably generated in the image acquisition process, the image must be pre-processed before the chip positioning parameters are acquired, and the noise affecting the recognition accuracy is removed. In addition, in order to obtain the chip boundary information and the soldering chip boundary information better, it is necessary to advance the regions of the two by preprocessing.

Edit: Cedar

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