Hongli Optoelectronics is researching LED packaging technology that can replace "copper column" high power devices

Hongli Optoelectronics revealed that the company is currently researching a new type of power LED device to replace the traditional "copper column" high power device.

Hongli Optoelectronics pointed out that the traditional device has a complicated structure and high cost, especially the heat dissipation efficiency is relatively low, and the power structure of the new structure has the advantages of high heat dissipation efficiency, simple structure and low cost, and the heat dissipation channels of the LED are assembled. The horizontal heat dissipation technology and the vertical heat dissipation technology, and the use of high emissivity materials as the "stage", ultimately achieve a significant reduction in LED junction temperature.

Hongli Optoelectronics emphasized that the technology has applied for invention patents, but the industrialization of the technology also needs to optimize the process, improve the surface reflection efficiency and the electrode fabrication process. The company is in the process of refining the technology of the technology and strives to achieve it in the next year. commercialize.

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