The Texas Instruments (TI) MSP430 family now includes the MSP430FR2512 and MSP430FR2522 microcontrollers, which leverage CapTIvate™ technology to bring capacitive sensing to cost-sensitive applications. These MCUs offer integrated capacitive touch capabilities, allowing developers to implement up to 16 buttons and proximity sensing in a wide range of systems—including industrial controls, home automation devices, appliances, power tools, home entertainment systems, and personal audio products.
One of the standout features of these new MCUs is their reliable and optimized performance. They are IEC 61000-4-6 certified, making them ideal for environments with electromagnetic interference, as well as exposure to oil, water, and grease. Additionally, they consume five times less power than competing solutions, enabling efficient operation with touch and proximity sensing through various materials like glass, plastic, and metal.
CapTIvate technology brings the advantages of capacitive touch and proximity sensing to a variety of applications such as access control panels, cooktops, wireless speakers, and power tools. This makes it easier for developers to enhance user interfaces without sacrificing performance or cost.
To help speed up development, TI offers the BOOSTXL-CAPKEYPAD BoosterPack, a plug-in module that works with the CapTIvate Programmer Board (CAPTIVATE-PGMR) or the TI LaunchPadâ„¢ Development Kit. This tool provides an easy way to evaluate capacitive sensing in real-time. The BoosterPack comes with a selection of MCUs, user-friendly tools, software, reference designs, and comprehensive documentation available in the CapTIvate Design Center and the online CapTIvate Technical Guide.
Developers can also tap into the Texas Instruments online support community to find answers, get assistance, and accelerate their projects using CapTIvate technology. This ecosystem ensures that even those new to capacitive sensing can quickly get up to speed.
In terms of packaging, the MSP430FR2512 and MSP430FR2522 are available in volume production. They come in a 20-pin ultra-thin quad flat no-lead (VQFN) package and a 16-pin thin compact outline package (TSSOP), offering flexibility for different design requirements.
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