TI's new reliable, anti-jamming capacitive sensing MCUs bring touch control technology to cost-sensitive industrial applications

The Texas Instruments (TI) MSP430 family now includes the MSP430FR2512 and MSP430FR2522 microcontrollers, which integrate CapTIvateâ„¢ technology for capacitive sensing. These MCUs are ideal for cost-sensitive applications that require reliable touch and proximity detection. With these devices, developers can implement up to 16 capacitive buttons along with proximity sensing in a wide range of systems, including industrial equipment, home automation, appliances, power tools, home entertainment, and personal audio devices. One of the key advantages of these MCUs is their high reliability and optimized performance. They are IEC 61000-4-6 certified, making them suitable for environments exposed to electromagnetic interference, oil, water, and grease. Additionally, they consume five times less power than competing solutions, enabling efficient operation even through glass, plastic, or metal overlays. CapTIvate technology brings the benefits of capacitive touch and proximity sensing to various applications such as access control panels, cooktops, wireless speakers, and power tools. This makes it easier for designers to add modern user interfaces without increasing costs significantly. To speed up development, TI offers the BOOSTXL-CAPKEYPAD BoosterPack, a plug-in module compatible with the CapTIvate Programmer Board (CAPTIVATE-PGMR) or the TI LaunchPadâ„¢ Development Kit. This module includes multiple MCUs, user-friendly tools, software, reference designs, and detailed documentation available in the CapTIvate Design Center and online technical guide. Developers can also join the Texas Instruments support community to get assistance, share ideas, and accelerate their projects using CapTIvate technology. In terms of packaging, the MSP430FR2512 and MSP430FR2522 are available in volume production in two options: a 20-pin ultra-thin quad flat no-lead (VQFN) package and a 16-pin thin small outline package (TSSOP), offering flexibility for different design requirements. Whether you're working on a compact device or a more complex system, these MCUs provide a robust and scalable solution for capacitive sensing applications.

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