IC development program introduced

On June 24, the Ministry of Industry and Information Technology released the “Outline for Promoting the Development of the National IC Industry” (hereinafter referred to as the “Outline”) on the official website.

According to industry insiders, this "Outline" is yet another important document following the announcement of the State Council's 2000 Document No. 18 ("Circular of the State Council on Printing and Encouraging Certain Policies for Encouraging the Development of the Software Industry and the Integrated Circuit Industry").

The reporter noted that the "Outline" has mentioned the development priorities of the upper, middle and lower reaches of integrated circuits, especially for the packaging industry, stating that it is necessary to vigorously promote the merger and reorganization of domestic packaging and testing companies and increase the degree of industrial concentration. To adapt to the needs of evolution and upgrade of integrated circuit design and manufacturing process nodes, the company has developed and industrialized the advanced packaging and testing technologies such as chip-level packaging (CSP), wafer-level packaging (WLP), through-silicon vias (TSV), and three-dimensional packaging.

The sales revenue in 2015 exceeded 350 billion yuan

On June 24th, the "Outline" issued by the Ministry of Industry and Information Technology pointed out that by 2015, significant achievements must be made in the innovation of the integrated circuit industry's development mechanism and mechanism, and a financing platform and policy environment suited to the law of industrial development should be established, and IC industry sales should be established. The income exceeds RMB 350 billion.

The reporter noted that people in the industry believe that with the diversification of intelligent terminal products, smart cars, smart homes, and various smart devices will accelerate the penetration of people's lives, and the future IC industry will have a huge space. But behind the bright future is the high import volume of IC industry.

According to statistics from the Customs, in 2012, China’s dependence on foreign crude oil was 58%, and the dependence on imports of semiconductor chips was close to 80%. The import rate of high-end chips exceeded 90%. In 2013, China’s IC imports continued to grow steadily, reaching US$231.3 billion.

Will set up a national industrial investment fund

Analysts believe that after the “Prism Gate” incident broke out, countries’ awareness of information security has risen to an unprecedented level. In the background of the wave of “going to IOE” in China, the localization of integrated circuits has attracted particular attention.

In response, Vice President Li Qi of CCID Consulting expressed to the reporter of “Daily Economic News” that “the Outline has been issued and there are also information security factors. Integrated circuits and software are the basis of the information industry and information security has already been mentioned. At an unprecedented height, even if domestic servers are used, domestic CPUs and memories are still used, but they are still not entirely domestically produced and safe. There are a total of eight "safeguards" in the "Outline" issued. The establishment of the leading group for the development of the national integrated circuit industry and the setting up of a national industrial investment fund to support IC manufacturing are very novel terms that warrant attention.

And Gu Wenjun, the chief analyst of iSuppli Semiconductor, said in microblogging that if the IC industry wants to achieve leapfrog development, it must cooperate closely with capital, become bigger and stronger through mergers and acquisitions, and acquire international advanced technology and enter the international industry through international mergers and acquisitions. alliance. At this time, the establishment of the fund is timely and rainy for the entire industry.

The reporter noted that the "Outline" has mentioned the development priorities of the upper, middle and lower reaches of integrated circuits, especially for the packaging sector, and vigorously promoted merger and reorganization of domestic packaging and testing companies to increase industrial concentration. To adapt to the needs of evolution and upgrade of integrated circuit design and manufacturing process nodes, the company has developed and industrialized the advanced packaging and testing technologies such as chip-level packaging (CSP), wafer-level packaging (WLP), through-silicon vias (TSV), and three-dimensional packaging. Related A-share companies include Changjiang Electronics Technology, Jingfang Technology and Huatian Technology.