The 2nd CEO Conference of the 3rd G20-LED Summit will be the future of the pulse packaging field
[High-tech LED reporter Zhao Hui Guangzhou report] 1. The 2nd CEO Conference of the 3rd G20-LED Summit was successfully held in Guangzhou on November 24, 2013. We discussed the theme of "Drive the Future of Lighting".
2. This CEO conference is a milestone meeting in the LED lighting industry. At the same time, I would like to thank the member companies, Hongli Optoelectronics, for their thoughtful work and support during the whole process of participating in the conference.
3. In 2013, the demand for LED lighting terminal market has entered a rapid improvement channel since the beginning of the year, and the general utilization rate of lighting enterprises is close to saturation. At the same time, it also drove the rapid utilization of the capacity utilization rate of the middle and upstream chips and packaging links, and the overall market trend of the industry is improving.
4. According to the report released by G20-LED Summit Think Tank, Gaogong LED Industry Research Institute (GLII), the overall output value of LED industry will increase by about 20% in the fourth quarter of this year, while the annual output value of LED indoor lighting will increase by 110%. %. It is expected that next year, although the LED indoor lighting output base will increase year by year, the output value growth rate will remain at around 60%.
5. In this CEO conference, the leaders and representatives of the participating members made in-depth exchanges and discussions on the market performance, pattern changes and industrial development trends in the first three quarters of their respective segments.
6. At this CEO conference, the leaders and representatives of the participating companies also formed an “invisible†norm on the terminal lighting market through the self-discipline of the industry and the full use of the CLEAR program.
In the field of LED midstream packaging, the overall market conditions are driven by the market demand for downstream terminal lighting applications. The capacity utilization rate of most excellent packaging companies is close to and exceeds the best level in history, and the overall revenue is also showing a good situation.
In terms of product proportion, the overall market share of the high-power LED market is squeezed by the new power supply and COB new packaging structure, and is gradually turning to the special lighting application market.
Affected by the continuous decline in device prices in recent years, the gross profit margin of most domestic packaging manufacturers is in a downward channel. Innovations in new packaging processes, new materials and new technologies will be the main factors driving the packaging industry to gradually increase gross margin.
Packaging companies are reducing manufacturing costs in various ways, such as improving chip-level heat dissipation performance to reduce heat-dissipation costs in the packaging process. Through research and development to meet the needs of intelligent control of lamps, there is a huge amount of research and development in color-changing temperature and color light sources. Market opportunities; In addition, process innovations, including chip-scale packaging, still have a large space for packaging cost reduction.
At the same time, overseas giants are gradually reducing production and manufacturing costs through localized R&D and manufacturing transfer, and gradually establish their own price advantages.
Since last year, the packaged product line has shifted from high-power devices to medium power and COB, and next year's mid-power and COB will account for 50% of overall sales. High-power LEDs will be mainly used in export lighting products. Medium power and COB will become mainstream and irreversible.
The packaging industry has entered a period of small profits but quick turnover, and companies should pay more attention to cost management.
The competition in the domestic market will become more intense in the future. Establishing the direction of product technology development will be the key factor for the future packaging companies to win the market. Secondly, the company's market strategy and management cost control capabilities, at this stage enterprises should be steady investment, work hard and should not be driven by the temptation of venture capital, regardless of input and output.
As a representative of the industry leading the industry, in recent years, domestic packaging brands are constantly squeezing the market share of multinational companies, and the future cooperation opportunities of both parties will continue to emerge.
For the development trend of the packaging industry, the emergence of new packaging technology will have greater uncertainty for the development of the industry. For enterprises positioning the mid-to-high-end device market, in the future, upstream chips manufacturers will face constant challenges in new technologies such as chip-level packaging. On the other hand, competition in the low-end market will become increasingly fierce. Especially in recent years, the average gross profit margin of the packaging industry has dropped from 50% in the previous years to 30%, and the gross profit margin of the low-end market in the future will be around 10%.
Packaging companies with future competitiveness, identify their own positioning, take high-margin products as a breakthrough, and gradually form the core technology competitiveness of enterprises themselves will become a key factor.
In the field of packaging equipment, after decades of development, the performance of domestic LED packaging equipment has been greatly improved, and some have even reached the international first-class level, and the high cost performance is gradually recognized by packaging companies.
The market share of imported packaging equipment represented by ASM is constantly being pursued by domestic equipment manufacturers, especially in the post-segment market segmentation such as dispensing, splitting and braiding.
The demand for packaging equipment is growing, but prices are falling rapidly. For enterprises, the core competitiveness of the future lies in the choice of the supply chain camp. The customer's customer strategy is changing from the decentralized situation of small and medium-sized customers in the past to the concentration of large customers, and the market differentiation is becoming more and more obvious.
At the same time, the demand for intelligent automatic production lines for lamps and lanterns is gradually increasing, and has been applied in large-scale lighting enterprises. Efficient manufacturing and consistent quality control benefits from automated manufacturing will help lighting companies gradually reduce manufacturing costs.
The participating member companies agreed that:
1. Members of the G20-LED Summit's industrial chain are in urgent need of effectively transmitting end-market demand from the bottom up, and based on supply chain strategy considerations, forming stable and deep cooperation in upstream and downstream supply chains.
2. G20-LED Summit members will make full use of the G20-LED lighting product specifications and CLEAR's two invisible hands to establish market benchmarks at the channel, owner and consumer levels. And from chips, devices to key components and materials, to lighting products, redefining the hidden "standards" of products that the market can trust.
3. Leading by the lighting companies within the members, using the upper and middle reaches supporting products of the member companies (chips, phosphors, devices, substrates, drive power, etc.), before the December 31, 2013 in the bulb, straight tube lights, spotlights , the downlights, the panel lights category to make the G20-LED lighting product specification level 1 model lamps.
The list of members of the 3rd G20-LED Summit (before and after the ranking):
Philips Lumileds
Shandong Inspur Huaguang Optoelectronics Co., Ltd. Guangzhou Hongli Optoelectronics Co., Ltd. Hubei Yutong Electronics Co., Ltd. Hangzhou Zhongwei Optoelectronic Technology Co., Ltd. Zhejiang Sunlight Lighting Group Co., Ltd. Shanxi Guangyu Semiconductor Lighting Co., Ltd. Jiangxi Lianchuang Optoelectronics Co., Ltd. Technology Co., Ltd. Hengdian Group Debang Lighting Co., Ltd. Zhejiang Yuanda Electronic Development Co., Ltd. Fujian Wanbang Optoelectronics Technology Co., Ltd. Tongfang Co., Ltd. Huacan Optoelectronics Co., Ltd. North Microelectronics Shenzhen Ruifeng Optoelectronics Co., Ltd. Infineon Electronics ( Hangzhou) Co., Ltd. Sichuan Xinli Light Source Co., Ltd. Dongguan Qinshang Optoelectronics Co., Ltd. Shenzhen Juzuo Lighting Co., Ltd. Tiantong High-tech Group Co., Ltd. Foshan Jiamei Times Lighting Co., Ltd.
2. This CEO conference is a milestone meeting in the LED lighting industry. At the same time, I would like to thank the member companies, Hongli Optoelectronics, for their thoughtful work and support during the whole process of participating in the conference.
3. In 2013, the demand for LED lighting terminal market has entered a rapid improvement channel since the beginning of the year, and the general utilization rate of lighting enterprises is close to saturation. At the same time, it also drove the rapid utilization of the capacity utilization rate of the middle and upstream chips and packaging links, and the overall market trend of the industry is improving.
4. According to the report released by G20-LED Summit Think Tank, Gaogong LED Industry Research Institute (GLII), the overall output value of LED industry will increase by about 20% in the fourth quarter of this year, while the annual output value of LED indoor lighting will increase by 110%. %. It is expected that next year, although the LED indoor lighting output base will increase year by year, the output value growth rate will remain at around 60%.
5. In this CEO conference, the leaders and representatives of the participating members made in-depth exchanges and discussions on the market performance, pattern changes and industrial development trends in the first three quarters of their respective segments.
6. At this CEO conference, the leaders and representatives of the participating companies also formed an “invisible†norm on the terminal lighting market through the self-discipline of the industry and the full use of the CLEAR program.
In the field of LED midstream packaging, the overall market conditions are driven by the market demand for downstream terminal lighting applications. The capacity utilization rate of most excellent packaging companies is close to and exceeds the best level in history, and the overall revenue is also showing a good situation.
In terms of product proportion, the overall market share of the high-power LED market is squeezed by the new power supply and COB new packaging structure, and is gradually turning to the special lighting application market.
Affected by the continuous decline in device prices in recent years, the gross profit margin of most domestic packaging manufacturers is in a downward channel. Innovations in new packaging processes, new materials and new technologies will be the main factors driving the packaging industry to gradually increase gross margin.
Packaging companies are reducing manufacturing costs in various ways, such as improving chip-level heat dissipation performance to reduce heat-dissipation costs in the packaging process. Through research and development to meet the needs of intelligent control of lamps, there is a huge amount of research and development in color-changing temperature and color light sources. Market opportunities; In addition, process innovations, including chip-scale packaging, still have a large space for packaging cost reduction.
At the same time, overseas giants are gradually reducing production and manufacturing costs through localized R&D and manufacturing transfer, and gradually establish their own price advantages.
Since last year, the packaged product line has shifted from high-power devices to medium power and COB, and next year's mid-power and COB will account for 50% of overall sales. High-power LEDs will be mainly used in export lighting products. Medium power and COB will become mainstream and irreversible.
The packaging industry has entered a period of small profits but quick turnover, and companies should pay more attention to cost management.
The competition in the domestic market will become more intense in the future. Establishing the direction of product technology development will be the key factor for the future packaging companies to win the market. Secondly, the company's market strategy and management cost control capabilities, at this stage enterprises should be steady investment, work hard and should not be driven by the temptation of venture capital, regardless of input and output.
As a representative of the industry leading the industry, in recent years, domestic packaging brands are constantly squeezing the market share of multinational companies, and the future cooperation opportunities of both parties will continue to emerge.
For the development trend of the packaging industry, the emergence of new packaging technology will have greater uncertainty for the development of the industry. For enterprises positioning the mid-to-high-end device market, in the future, upstream chips manufacturers will face constant challenges in new technologies such as chip-level packaging. On the other hand, competition in the low-end market will become increasingly fierce. Especially in recent years, the average gross profit margin of the packaging industry has dropped from 50% in the previous years to 30%, and the gross profit margin of the low-end market in the future will be around 10%.
Packaging companies with future competitiveness, identify their own positioning, take high-margin products as a breakthrough, and gradually form the core technology competitiveness of enterprises themselves will become a key factor.
In the field of packaging equipment, after decades of development, the performance of domestic LED packaging equipment has been greatly improved, and some have even reached the international first-class level, and the high cost performance is gradually recognized by packaging companies.
The market share of imported packaging equipment represented by ASM is constantly being pursued by domestic equipment manufacturers, especially in the post-segment market segmentation such as dispensing, splitting and braiding.
The demand for packaging equipment is growing, but prices are falling rapidly. For enterprises, the core competitiveness of the future lies in the choice of the supply chain camp. The customer's customer strategy is changing from the decentralized situation of small and medium-sized customers in the past to the concentration of large customers, and the market differentiation is becoming more and more obvious.
At the same time, the demand for intelligent automatic production lines for lamps and lanterns is gradually increasing, and has been applied in large-scale lighting enterprises. Efficient manufacturing and consistent quality control benefits from automated manufacturing will help lighting companies gradually reduce manufacturing costs.
The participating member companies agreed that:
1. Members of the G20-LED Summit's industrial chain are in urgent need of effectively transmitting end-market demand from the bottom up, and based on supply chain strategy considerations, forming stable and deep cooperation in upstream and downstream supply chains.
2. G20-LED Summit members will make full use of the G20-LED lighting product specifications and CLEAR's two invisible hands to establish market benchmarks at the channel, owner and consumer levels. And from chips, devices to key components and materials, to lighting products, redefining the hidden "standards" of products that the market can trust.
3. Leading by the lighting companies within the members, using the upper and middle reaches supporting products of the member companies (chips, phosphors, devices, substrates, drive power, etc.), before the December 31, 2013 in the bulb, straight tube lights, spotlights , the downlights, the panel lights category to make the G20-LED lighting product specification level 1 model lamps.
The list of members of the 3rd G20-LED Summit (before and after the ranking):
Philips Lumileds
Shandong Inspur Huaguang Optoelectronics Co., Ltd. Guangzhou Hongli Optoelectronics Co., Ltd. Hubei Yutong Electronics Co., Ltd. Hangzhou Zhongwei Optoelectronic Technology Co., Ltd. Zhejiang Sunlight Lighting Group Co., Ltd. Shanxi Guangyu Semiconductor Lighting Co., Ltd. Jiangxi Lianchuang Optoelectronics Co., Ltd. Technology Co., Ltd. Hengdian Group Debang Lighting Co., Ltd. Zhejiang Yuanda Electronic Development Co., Ltd. Fujian Wanbang Optoelectronics Technology Co., Ltd. Tongfang Co., Ltd. Huacan Optoelectronics Co., Ltd. North Microelectronics Shenzhen Ruifeng Optoelectronics Co., Ltd. Infineon Electronics ( Hangzhou) Co., Ltd. Sichuan Xinli Light Source Co., Ltd. Dongguan Qinshang Optoelectronics Co., Ltd. Shenzhen Juzuo Lighting Co., Ltd. Tiantong High-tech Group Co., Ltd. Foshan Jiamei Times Lighting Co., Ltd.
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